Intel, a leading computer chip manufacturer, has announced its plans to invest €4.2 billion (US$4.6 billion) in the establishment of a new chip factory in Wrocław, Poland. The construction of this semiconductor assembly and test facility is expected to generate numerous job opportunities, in addition to the 2,000 permanent positions that will be available once the complex is fully operational.

The company intends to begin the design and planning process immediately, pending approval from the European Commission, and aims to complete the facility by 2027. Intel emphasized the importance of building a more resilient supply chain for semiconductors in light of recent global disruptions.

As part of its efforts to regain 20% of global semiconductor manufacturing capacity by 2030, the European Union has set its sights on establishing a strong presence in this industry. Intel's investment in Poland, along with its existing wafer fabrication facility in Leixlip, Ireland, and its planned facility in Magdeburg, Germany, will contribute to the creation of an end-to-end semiconductor manufacturing value chain in Europe.

Wafer fabrication facilities, also known as "fabs," play a crucial role in chip production by employing advanced chemical, mechanical, and optical processes to create chips on silicon wafers. Assembly and test facilities, like the one planned near Wrocław, receive the completed wafers from fabs, cut them into individual chips, assemble the final products, and conduct performance and quality tests.

Intel CEO Pat Gelsinger expressed enthusiasm about the investment in Poland, citing the country's existing Intel operations, its advantageous proximity to Intel sites in Germany and Ireland, its cost competitiveness compared to global manufacturing locations, and its promising talent pool that Intel is eager to contribute to fostering and expanding.