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Laser cutting machine • Water jet guided laser cutting machine • Laser wafer dicing machine • Laser stencil cutting machine • Laser drilling machine |
| Employees : |
100+ |
| Year established : |
1997 |
Business : |
Distributor |
SYNOVA’s story begins with the invention of the water jet guided laser developed in the 1990s at the Federal Institute of Technology (EPFL) in Lausanne, Switzerland, made by PhD student Bernold Richerzhagen. This innovation resolved a number of well-known problems associated with existing cutting technologies in industrial applications. Consequently, Synova was founded by Richerzhagen in 1997 in Lausanne to make the patented Laser MicroJet (LMJ) technology available to high-tech industrial manufacturers.
Since 1998, various industries worldwide have switched to this laser process for their production needs. In addition, the particular advantages have led to a number of new applications such as in the domain of sensitive material processing where Synova was the first company to introduce the laser into semiconductor wafer dicing in 2001.
Since 2003, the company established wholly owned local subsidiaries in the USA, Japan, India and Korea for optimized customer support. These have since been expanded to include micro-machining centers (MMCs) with Germany and China in preparation.
SYNOVA presently has 140 employees including 30 engineers focused primarily on researching new material cutting solutions, further applications and laser cutting equipment. Aside from research, both the final assembly and testing of up to 100 machines a year are performed in Synova’s modern, 3100 square meter facilities in Duillier.
In 2010 Synova successfully entered the gem diamond cutting business. Subsequently, the company was strategically re-organized according to market segments forming three distinct business units: Diamonds, Semiconductors and Metal Industry.
SYNOVA has established several partnerships with leading industrial machine manufacturers for the production of LMJ machines, most recently with Makino. The company also cooperates with respected research institutions, universities and industry players on strategic projects to further develop and exploit the technology, including the Fraunhofer ILT and IPT, EMPA and Carl Zeiss Jena.
SYNOVA is now a company with global reach focused on delivering highest-quality solutions and services to its customers wherever they are. We strongly believe that the motor of our success and growth are our technology, experience and dedication to our customers, today and tomorrow.
| Laser Cutting Systems The LCS 300 is a versatile laser cutting system conceived for micromachining applications in a variety of industrial sectors.
This laser cutting system has a working area of 300 x 300 mm and is suited for various applications, such as cutting, drilling, grooving of any material. The work piece is fixed on a M6-thread table.
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| Laser Dicing Systems The Laser Dicing System is primarily designed for semiconductor back-end processing, mainly wafer dicing and grooving applications.
The LDS 200 A is a fully automatic, cassette-to-cassette wafer dicing machine including fast quality check (control of kerf width, position and roughness).
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| Laser Edge Grinding Systems The Laser Microjet® wafer edge grinding machine is suitable for grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength. | 
| Laser Stencil Cutting Systems The LSS series of laser stencil cutting machines is especially suited for high-precision cutting of stencils and metal masks. The large working area allows the cutting of any stencil size.
The laser stencil cutting machine has a Gerber interface and the data can be automatically transferred to the NC controller.
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Laser Edge Grinding System
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+41 21 694 35 00 
